AS568-386 FFKM O-Ring — 430.66 × 5.33 mm

Dimensions

Dash number	AS568-386
Inside diameter (ID)	430.66 mm  (16.955 in)
Cross section (CS)	5.33 mm  (0.21 in)
Outside diameter (OD)	441.32 mm  (17.375 in)
Material	Aperflu 2275 perfluoroelastomer (FFKM)
Service temperature	up to 200 °C continuous

Semiconductor wafer processing

In plasma etch, CVD and wet-clean chambers, this seal holds up where fluorine plasma and aggressive chemistries attack ordinary elastomers. Aperflu 2275 offers the low-outgassing, low-extractable behaviour that protects wafer yield and reduces particle contamination.

Why Aperflu 2275 FFKM

The compound is moulded, de-flashed and inspected to a burr-free finish, and every batch ships with its own certificate of analysis for traceability.

Typical applications

Large flanges, vessel and tank closures, heavy machinery and static joints, where Aperflu 2275 outperforms FKM and EPDM in aggressive media and elevated temperature.

Compound properties

Property	Typical value	Test method
Hardness	70 – 71 Shore A	GB/T 39693.4
Tensile strength	21.2 – 21.8 MPa	GB/T 528 (dumbbell type 2)
Elongation at break	155 – 170 %	GB/T 528 (dumbbell type 2)
Compression set, 200 °C × 70 h (25 %, method B)	15 – 16 %	GB/T 7759.1

All values are typical. Every batch is shipped with an individual certificate of analysis and may differ from the typical values listed here.

Chemical resistance